Capabiliy1

日期: 2019-10-14
浏览次数: 3

Rigid PCB Capability


Layer count1 ~ 24layers
Laminates typeFR-4(High Tg, Halogen Free, High Frequency)
FR-5, CEM-3, PTFE, BT, Getek, Aluminium base,Copper base,KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon
Board thickness6-240mil
Max Base copper weight210um (6oz) for inner layer 210um (6oz) for outer layer
Min mechanical drill size0.2mm (0.008')
Aspect ratio12:01
Max panel sizeSigle side or double sides:500mm*1200mm,
Multilayer layers:508mm X 610mm (20' X 24')
Min line width/space0.076mm / 0.0.076mm (0.003' / 0.003')
Via hole typeBlind / Burried / Plugged(VOP,VIP…)
HDI / MicroviaYES
Surface finishHASL
Lead Free HASL
Immersion Gold (ENIG), Immersion Tin, Immersion Silver
Organic Solderability Preservative (OSP) / ENTEK
Flash Gold(Hard Gold plating)
ENEPIG
Selective Gold Plating, Gold thickness up to 3um(120u')
Gold Finger, Carbon Print, Peelable S/M
Solder mask colorGreen, Blue, White, Black, Clear, etc.
ImpedanceSingle trace,differential , coplanar impedance controlled ±10%
Outline finish typeCNC Routing; V-Scoring / Cut; Punch
TolerancesMin Hole tolerance (NPTH)±0.05mm
Min Hole tolerance (PTH)±0.075mm
Min Pattern tolerance±0.05mm


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