| Layer count | 1 ~ 24layers |
| Laminates type | FR-4(High Tg, Halogen Free, High Frequency) |
| FR-5, CEM-3, PTFE, BT, Getek, Aluminium base，Copper base，KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Board thickness | 6-240mil |
| Max Base copper weight | 210um (6oz) for inner layer 210um (6oz) for outer layer |
| Min mechanical drill size | 0.2mm (0.008') |
| Aspect ratio | 12:01 |
| Max panel size | Sigle side or double sides:500mm*1200mm, |
| Multilayer layers:508mm X 610mm (20' X 24') |
| Min line width/space | 0.076mm / 0.0.076mm (0.003' / 0.003') |
| Via hole type | Blind / Burried / Plugged(VOP,VIP…) |
| HDI / Microvia | YES |
| Surface finish | HASL |
| Lead Free HASL |
| Immersion Gold (ENIG), Immersion Tin, Immersion Silver |
| Organic Solderability Preservative (OSP) / ENTEK |
| Flash Gold(Hard Gold plating) |
| ENEPIG |
| Selective Gold Plating, Gold thickness up to 3um(120u') |
| Gold Finger, Carbon Print, Peelable S/M |
| Solder mask color | Green, Blue, White, Black, Clear, etc. |
| Impedance | Single trace,differential , coplanar impedance controlled ±10% |
| Outline finish type | CNC Routing; V-Scoring / Cut; Punch |
| Tolerances | Min Hole tolerance (NPTH) | ±0.05mm |
| Min Hole tolerance (PTH) | ±0.075mm |
| Min Pattern tolerance | ±0.05mm |